Welcome To b2b168.com, Join Free | Sign In
中文(简体) |
中文(繁體) |
Francés |Español |Deutsch |Pусский |
| No.9067235
- Product Categories
- Friendly Links
Information Name: | Supply BGA rework station VECTECH BGA3500 optical image alignment infrared |
Published: | 2012-11-28 |
Validity: | 30 |
Specifications: | Wei Symantec VECTECH BGA3500 |
Quantity: | 1.00 |
Price Description: | |
Detailed Product Description: | [Special] De Jian BGA rework station Taiwan VECTECH original brand, the optical image of the the Model the BGA3500 威 iron bit infrared BGA repair workstation precise alignment of the optical image, infrared non-contact temperature sensor, clearer watch BGA soldering removable and washable. grams. Product Name: optical image bit infrared BGA repair workstations (very large at the bottom of the heater) Goods number: Wei Symantec VECTECH BGA3500 11 major characteristics: infrared non-contact temperature sensor, to detect BGA actual temperature to ensure temperature output stable and accurate. Upper part infrared heater adjustable heated aperture size, no need to replace the different part size BGA hot air nozzle. RPC video monitor, you can watch the BGA soldering cannibalize the whole process, immediately determine the status of the solder ball melting tin welding success. Precise optical image on bits and parts placed ± 10μm error value of the operating system. Upper cooling fan center output red dot indicating the position of the upper part of the center point of the infrared heater and parts center point placement. After desoldering BGA components workflow, the system automatically turns on the top and the bottom of the cooling fan, cooling the PC board. The upper infrared heaters lift electric motor automatically move up and down, or manual control, lifting stroke. Fixed PC board sizes up to 700 × 700mm. The bottom of the large PC board support frame, easy to install, avoids the boards Alice deformation; irregular PC board special holding fixture. Bottom of the infrared ceramic heater, full power output can control a large area, the PC board for smaller size can be reduced? Power output. IRSoft via PC connection, you can modify the parameters, and the recorded temperature, time, analyze workflow graphs and data. Non-contact infrared temperature sensor parts cannibalized and reflow process to detect the BGA the actual temperature via infrared non-contact temperature sensor, microprocessor controlled infrared power output up and down, to ensure stable and accurate temperature output. Need to replace BGA hot air mouth infrared heater, based on the BGA part size, adjust the heater thermal radiation window aperture size, no need to replace the the BGA different size of hot air nozzle. Window aperture 20mm ~ 60mm. RPC solder ball melting tin video surveillance system via RPC video surveillance system to observe the activation of the BGA parts flux, dissolved tin, collapse and the formation of the solder joints, can immediately determine success. The most critical visual message. 4 optical image on the bit parts placement system image registration system control box stretching, the system automatically switches the video signal to the RPC tin ball melting tin image. 10 speed digital zoom, 20x Precision optical zoom camera instrument, and two different colors of the LED light source, BGA ball back to the PC board solder joints for the best image contrast, the position is clear. Micro QFN the CSP component placement accuracy of ± 10μm image registration system. 4-1 PC board X - Y-axis fine-tuning the mobile system image on the bit parts placement system moves after careful X - Y - θ angle. X - Y mobile, using 0.01 micrometer head decline automatically adjusted, the PC board position to achieve the most accurate alignment effect. θ angle rotation 360 ° rotation of the BGA parts. 5. Desoldering parts PC board placed the positioning instructions point upper cooling fan center point output red spot, adjust the PC board is placed at the appropriate fixed position, the red dot shows desoldering BGA parts center point, this red spot IR position of the center point of the upper heater. After desoldering parts of the PC board cooling system, the system automatically turns on automatically stop after the cooling fan at the top and bottom of the cooling fan blowing cold air 150s. 7 the IR upper infrared heater control system ˙ technique using infrared heating of the wavelength of 2 to 8 μm, avoid chromatic aberration reflector uneven heating, uniform heating of the element, minimizing the transverse temperature difference (△ T), to prevent wetting time too long, to avoid cold welding or overheating damage. IR the upper infrared heater, electric moves up and down, or manual key control, depending on the needs of a high degree of control of the upper heater lifting stroke. 8 PC plate holder mobile platform fixed the maximum size of the PC board area up to 700 × 700 mm. PC plate at the bottom of the support frame and a special jig PC board fixture stretch device effectively fixed PC board, due to heat or cool the tension and avoid deformation of the PC board. Irregular PC boards use different fixtured special support frame of the bottom of the PC board, the prevention of the PC Banban Alice deformation. Very large infrared ceramic heater at the bottom of the bottom of the system 10. Infrared ceramic heater area of ??390 × 260 mm. The bottom of the heater can be divided into five blocks to control heating; PC board for smaller size, the smallest heater area of ??125 × 260 mm. 11. Temperature software IR soft features via PC through the the desoldering temperature of software IR soft connection of BGA parts cannibalized, reflow process parameters to modify and control the temperature, time output. Record all the temperature, time and analysis workflow, graph and other data, can store up to 100 groups of parameter settings. 12 BGA bumping jigs can be arranged in accordance with the BGA parts of different size and spherical, making for BGA ball fixture, and back to the solder ball BGA parts. PC board cannibalize BGA to → → BGA back the BGA in addition to tin → BGA solder ball bumping → BGA solder ball reflow soldered to the PC board time to meet customer demand for tools and equipment and desoldering technology, the company provides a complete range of BGA repair desoldering equipment specifications: the total net weight: 80 Kg Packing size: 970 * 830 * 520 (mm) (a) IR the dual infrared repair station specifications 1. Total power: 3200W (max) 2. The bottom of the preheating power: 400W * 6 = 2400W (ceramic infrared heat) 3. Upper heating power: 180W * 4 = 720W (infrared heating tube, wavelength of about from 2 ~~ 8 μm, size: 60 * 60mm) 4. The bottom of the heat radiation warm-up area: 390 * 260mm 5. The upper heater adjustable range: 20mm ~ 60mm 6. The upper heating time: about 10s (room temperature to 230 ° C). Vacuum pump: 12V/300mA, 0.05Mpa 8. Upper cooling fan: 12V/300mA 15CFM 9. Laser-bit pipe: 3V/30mA 2 only 10. LCD display window: 65.7 * 23.5 (mm) 16 * 2 characters 11. Computer software: standard RS-232C (software the IRS of can connect to the PC) 12. Move up and down motor: 24VDC/100mA 13. Move up and down the arm stroke: 93mm 14. Infrared temperature measurement sensors: 0 ~ 300 ℃ (temperature range) 15. Maximum PC board size: 700mm * 700mm PC board holder 16. Fuse: 20A (220V) 17. Input operating voltage: AC230V / 20A / 60Hz (single-phase) (b) the PL optical image monitoring system specifications. Power: about 15W 2. Optical video surveillance system: 12V/300mA; 22 * ??10-fold amplification; Horizontal Resolution 480 lines; PAL standard (Phase Alternating Line system); 3. Vacuum pump: 12V/600mA 0.05Mpa (max) 4. LED light source: white LED lighting; red LED illumination (adjustable brightness) 5. Mobile arm stroke: 93mm 6. Moving motor: 24VDC/100mA 7. Fuse: 0.5A (230V) 8. Input operating voltage: 230V / 50 to 60Hz (single phase) 9. Optical video surveillance system, the output signal is a video signal VIDEO. 10. The the PL optical image of the bit parts placed on the system, and the dissolved tin tin ball RPC monitor system, the switch part of the front and rear telescopic boom by PL; the IR optical image-bit systems, lighting equipment, PL keyboard to control the upper and lower light source brightness [Special] the Des Kennedy BGA rework station Taiwan VECTECH original brand, optical image bit infrared BGA the maintenance workstation accurate optical image registration, non-contact infrared temperature sensors, clearer monitoring BGA soldering removable and washable. models BGA3500 Wei Symantec. |
Admin>>>
You are the 12861 visitor
Copyright © GuangDong ICP No. 10089450, The Dongguan Germany Caine hardware electronic trading All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility
You are the 12861 visitor
Copyright © GuangDong ICP No. 10089450, The Dongguan Germany Caine hardware electronic trading All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility